2025 Speakers

20 years of microelectronic expertise started post phD with Infineon and Qimonda. Specialization in 3D-heterogenous micro integration since 15 years with Fraunhofer. Focus was and is the development and establishing of 3D-technologies as silicon chip stacking with vertical wiring for power and signaling (TSV … through silicon wires) with integrated horizontal fluidic cooling and their realization in a 200mm/300mm wafer pilot line for small serial production.