AI applications are increasing power density in data centres, while modern IT components are designed to withstand ever higher ambient temperatures. This presentation will examine the influence of varying temperature levels and approach temperatures, as well as the challenge of maintaining all defined operating conditions under full and partial load. For centralised cooling, a solution with free-cooling chillers containing oil-free centrifugal compressors will be considered. The thermodynamic design of cooling components is becoming increasingly complex, as centralised chillers supply Coolant Distribution Units (CDUs), Computer Room Air Conditioners (CRAHs), and Fan-Wall Units (FWUs). Maintaining consistent system temperatures across all these systems is crucial to maximising free cooling utilisation and, therefore, overall efficiency.